Polyimide film
Keywords:
insulation Material
Category:
Product Description
Product Applications
Product Description:
Polyimide film is a novel high‑temperature‑resistant organic polymer film. It is produced by polycondensation of pyromellitic dianhydride (PMDA) and 4,4′‑oxydianiline (ODA) in the highly polar solvent dimethylacetamide (DMAC), followed by solution casting to form a film and subsequent imidization. It is currently the highest‑performing insulating film material in the world.
Polyimide film exhibits excellent thermal stability, chemical resistance, and mechanical properties, typically appearing in an orange‑yellow or brownish hue. It boasts outstanding high‑temperature resistance, radiation resistance, and electrical insulation performance, with an insulation class of C (200°C). Additionally, polyimide film demonstrates superior mechanical characteristics, including tensile strength, edge insulation and tear resistance, as well as strong dielectric strength. Its surface is smooth and it exhibits good adhesion to insulating varnishes. Furthermore, the material itself is flame‑retardant, meeting the UL 94 V‑0 flammability rating.
Polyimide film is primarily used in the electronics industry, particularly as a substrate for flexible printed circuit boards and as an insulating material for high‑temperature motors and electrical appliances. It can also be employed as a winding insulation material for electromagnetic wires, among other applications.
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Table 1: Performance Requirements Independent of Thickness
| Performance | Unit | Requirements | IEC 60674-2:1988 Article number in the middle section |
Applicable Models | |||
| Homogeneous benzene-type | Benzene affinity | Biphenylic | |||||
| Density | kg/㎡ | 1.425±10 | 1.480±10 | 1.390±10 | 4. Method Da | 1.3.4 | |
| Melting point | Non-melting 4 | Non-melting 4 | Non-melting 4 | 1.2.3.4 | |||
| Relative permittivity 23°C |
50Hz | 3.5±0.4 | 3.5±0.4 | 3.5±0.4 | 16.1b | 1.3.4 | |
| 1KHz | 3.4±0.4 | 3.4±0.4 | 3.4±0.4 | ||||
| Dielectric loss Factor: 23°C, 50 Hz or 1 kHz |
≤4.0×10 -3 | ≤4.0×10 -3 | ≤4.0×10 -3 | 16.1b | 1.2.3.4 | ||
| Volume resistivity | Ω.m | ≥1.0×10 10 | ≥1.0×10 13 | ≥1.0×10 13 | 15.1c | 1.2.3.4 | |
| Surface resistivity | Omega | ≥1.0×10 14 | ≥1.0×10 15 | ≥1.0×10 15 | 14c | 1.2.3.4 | |
| Dimensional stability (shrinkage in the longitudinal and transverse directions) | 150℃ | % |
≤0.35 | ≤0.20 | ≤0.20 | 23 | 1.2 |
| 400℃ | ≤2.50 | ≤1.00 | ≤3.00 | 1 | |||
| 200℃ | ≤0.05 | ≤0.04 | - | 3 | |||
| 200℃ | ≤5.00 | - | - | 4 | |||
| Water absorption (after 24 hours of exposure to moisture) | % | ≤4.00 | ≤2.00 | ≤2.00 | 30 | 1.2.3.4 | |
| Long-term heat resistance temperature index | °C | 200 | |||||
| Note: The requirements for Type 2 regarding density and relative permittivity depend largely on the relative thicknesses of PI and FEP. FEP is a heat‑sealable fluorinated ethylene–propylene resin. | |||||||
| a. It is recommended to use a mixture of carbon tetrachloride and n-heptane. | |||||||
| b. Non-contact electrodes or evaporated metal electrodes are employed. For the non-contact electrode method, the calculation formula shall be in accordance with the provisions of Table 1 in GB/T 13542.3-2006. | |||||||
| c. After treatment at 200°C for 1 hour, measurements are taken at (200°C ± 5°C). | |||||||
| d. For Type 2, the FEP coating will melt. | |||||||
| e. Only applicable to thicknesses ≥ 25 μm. | |||||||
Table 2: Performance Requirements Related to Thickness
| Performance | Scope of Application | Unit | Requirements | IEC60674-2:1988 Article number in the middle section |
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| Nominal thickness (μm) | ||||||||||||
| 7.5 | 13 | 20 | 25 | 40 | 50 | 75 | 100 | 125 | ||||
| Tensile strength (Longitudinal and transverse) |
Homogeneous benzene-type | MPa |
≥110 | ≥138 | - | ≥165 | - | ≥165 | ≥165 | - | ≥165 | 10a |
| Para-type | ≥133 | ≥176 | ≥294 | ≥294 | ≥294 | ≥294 | ≥294 | ≥294 | ≥294 | |||
| Biphenyl type | ≥110 | ≥138 | ≥196 | ≥196 | ≥196 | ≥196 | ≥196 | ≥196 | ≥196 | |||
| Elongation at break (longitudinal and transverse) | Homogeneous benzene-type | % |
≥25 | ≥35 | - | ≥40 | - | ≥50 | ≥50 | - | ≥50 | 10b |
| Para-type | ≥6 | ≥8 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | |||
| Biphenyl type | ≥25 | ≥40 | ≥80 | ≥80 | ≥80 | ≥80 | ≥80 | ≥80 | ≥80 | |||
| AC Electrical Strength (48–62 Hz) | Homogeneous benzene-type | V/μm | ≥120 | ≥120 | - | ≥235 | - | ≥195 | ≥175 | - | ≥120 | 18.1b |
| Para-type | ≥150 | ≥150 | ≥200 | ≥200 | ≥180 | ≥180 | ≥130 | ≥110 | ≥95 | |||
| Biphenyl type | ≥150 | ≥150 | ≥200 | ≥200 | ≥195 | ≥195 | ≥135 | ≥110 | ≥110 | |||
| a. Test conditions for tensile speed and elongation at break: tensile speed is 50 mm/min, and the gauge length is 100 mm. b. The AC dielectric strength test shall be conducted in air, using electrodes with a diameter of Φ6 mm. |
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Product Technical Requirements: GB/T13542-2009
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